Method of manufacturing a semiconductor device

ABSTRACT

Disclosed is a method of manufacturing a semiconductor device. The semiconductor device may be manufactured by forming a trench extended in a first direction within a first pipe gate, forming a trench filled structure including a first sacrificial layer along a surface of the trench, a second pipe gate along a surface of the first sacrificial layer, and a second sacrificial layer filled in a center area of the trench opened by the second pipe gate inside the trench, and forming a partition pipe gate disposed within the trench in a second direction crossing the first direction to divide the first sacrificial layer into first sacrificial patterns and to divide the second sacrificial layer into second sacrificial patterns.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a Divisional of U.S. application Ser. No.14/817,770 filed Aug. 4, 2015, present application claims priority toKorean patent application number 10-2015-0029791 filed on Mar. 3, 2015,in the Korean Intellectual Property Office, the entire disclosure ofwhich is incorporated by reference herein.

BACKGROUND

1. Technical Field

Various embodiments generally relate to a semiconductor device and amethod of manufacturing the same, and more particularly, to athree-dimensional memory device and a method of manufacturing the same.

2. Related Art

A semiconductor device includes a memory device capable of storing data.The memory device includes a memory cell array region, in which memorycell strings are disposed. The memory device also includes a peripheralcircuit region, in which a peripheral circuit for driving the memorycell strings is disposed.

To increase the integration of semiconductor devices, athree-dimensional (3D) memory device has been suggested. In athree-dimensional (3D) memory device memory cells configuring memorycell strings are stacked on a substrate and the memory cells arethree-dimensionally arranged. Recently, techniques for further improvingintegration of the 3D memory device have been developed. Further,various techniques for simplifying a manufacturing process of the 3Dmemory device have been developed.

SUMMARY

According to an embodiment, there may be provided a semiconductordevice. The semiconductor device may include a first pipe gate includinga trench extended in a first direction. The semiconductor device mayinclude a second pipe gate formed in the first direction and spacedapart from the surface of the trench, and configured to divide thetrench into a first space and a second space. The semiconductor devicemay include a partition pipe gate extended in a second directioncrossing the first direction, and configured to divide the first spaceinto first areas, and divide the second space into second areas. Thesemiconductor device may include a first pipe channel formed inside eachof the first areas, and a second pipe channel formed inside each of thesecond areas.

The second pipe channel has a length in the second direction. The firstpipe channel has a length in the second direction. The length of thesecond pipe channel is less than the length of the first pipe channel.

According to an embodiment, there may be provided a semiconductordevice. The semiconductor device may include a first pipe gate includinga trench extended in a first direction, and a second pipe gate formedaccording to a shape of a surface of the trench while being spaced apartfrom the surface of the trench. The second pipe gate may be configuredto divide the trench into a first space and a second space. Thesemiconductor device may include a partition pipe gate extended in asecond direction crossing the first direction. The semiconductor devicemay be configured to divide the first space adjacent to the surface ofthe trench into first channel areas, and divide the second space intosecond channel areas. The semiconductor device may include a first pipechannel formed inside each of the first channel areas, and a second pipechannel formed inside each of the second channel areas.

The semiconductor device may further include a drain side stackstructure on the second pipe gate while surrounding the first drain sidechannel and the second drain side channel, and a source side stackstructure on the second pipe gate while surrounding the first sourceside channel and the second source side channel. The source side stackstructure and the drain side stack structure have substantially the sameheight.

According to an embodiment, there may be provided a method ofmanufacturing a semiconductor device. The method of manufacturing thesemiconductor device may include forming a trench extended in a firstdirection within a first pipe gate. The method of manufacturing thesemiconductor device may include forming a trench filled structureincluding a first sacrificial layer along a surface of the trench, asecond pipe gate along a surface of the first sacrificial layer, and asecond sacrificial layer filled in a center area of the trench opened bythe second pipe gate inside the trench. The method of manufacturing thesemiconductor device may include forming a partition pipe gate disposedwithin the trench in a second direction crossing the first direction todivide the first sacrificial layer into first sacrificial patterns andto divide the second sacrificial layer into second sacrificial patterns.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1D are diagrams illustrating a representation of an exampleof a semiconductor device according to an embodiment.

FIGS. 2A to 2D are diagrams illustrating a representation of an exampleof a structure of a pipe gate according to an embodiment.

FIGS. 3A to 3B, 4A to 4B, 5A to 5D, 6A to 6B, and 7A to 7F are diagramsfor describing a representation of an example of a method of amanufacturing method of a semiconductor device according to anembodiment.

FIG. 8 is a diagram for describing a representation of an example of astructure of a pipe gate according to an embodiment.

FIG. 9 is a configuration diagram illustrating a representation of anexample of a memory system according to an embodiment.

FIG. 10 is a configuration diagram illustrating a representation of anexample of a computing system according to an embodiment.

DETAILED DESCRIPTION

Hereinafter, an various examples of embodiments will be described withreference to the accompanying drawings. However, the embodiments are notlimited to the examples disclosed below, but may be variouslyimplemented in different forms, and the scope of the description is notlimited to the embodiments to be described below.

Various embodiments may provide for a semiconductor device capable ofimproving the integration of a three-dimensional memory device through asimplified process, and a method of manufacturing the same.

FIGS. 1A to 1D are diagrams illustrating a representation of an exampleof a semiconductor device according to an embodiment. More particularly,FIG. 1A is a perspective view of a three-dimensional (3D) memory deviceaccording to an example of an embodiment. In FIG. 1A, an insulatinglayer is not illustrated. FIG. 1B is a layout view illustratingrepresentations of examples of channels and conductive patterns of the3D memory device according to an embodiment. FIG. 1C is across-sectional view of a representation of an example of a crossingpart of a source select line and a first source side channel. FIG. 1D isa cross-sectional view of a representation of an example of a crossingpart of a source select line and a second source side channel.

Referring to FIG. 1A, the 3D memory device according to an embodimentmay include a first channel layer CH1, a second channel layer CH2, apipe gate PG, a source side stack structure S_ML, and a drain side stackstructure D_ML.

The pipe gate PG may include a first pipe gate PG1, a second pipe gatePG2, and a partition pipe gate PT (illustrated in FIGS. 1C and 1D). Thepipe gate PG may further include a third pipe gate PG3 covering thefirst and second pipe gates PG1 and PG2 and the partition pipe gate PT.

The first pipe gate PG1 includes a trench extended in a first direction(for example, a Y-direction). The second pipe gate PG2 and the partitionpipe gate PT are disposed inside the trench of the first pipe gate PG1.The second pipe gate PG2 and the partition pipe gate PT are formed todivide the trench of the first pipe gate PG1 into first channel areasand second channel areas. Structures of the first pipe gate PG1, thesecond pipe gate PG2, and the partition pipe gate PT will be describedin below with reference to FIGS. 2A to 2D.

The first channel layer CH1 may include a first pipe channel P_CH1, afirst source side channel S_CH1, and a first drain side channel D_CH1.The first source side channel S_CH1 and the first drain side channelD_CH1 are extended from the first pipe channel P_CH1 on the same planeas an upper surface of the second pipe gate PG2 to further protrudeupwardly more than the second pipe gate PG2. The first pipe channelP_CH1 is formed inside the first channel area defined by the first pipegate PG1, the second pipe gate PG2, and the partition pipe gate PT. Thefirst source side channel S_CH1 and the first drain side channel D_CH1pass through the third pipe gate PG3.

The second channel layer CH2 may include a second pipe channel P_CH2, asecond source side channel S_CH2, and a second drain side channel D_CH2.The second source side channel S_CH2 and the second drain side channelD_CH2 are extended from the second pipe channel P_CH2 on the same planeas the upper surface of the second pipe gate PG2 to further protrudeupwardly more than the second pipe gate PG2. The second pipe channelP_CH2 is formed inside the second channel area defined by the first pipegate PG1, the second pipe gate PG2, and the partition pipe gate PT. Thesecond source side channel S_CH2 and the second drain side channel D_CH2pass through the third pipe gate PG3.

The first and second channel areas are divided with the second pipe gatePG2 interposed therebetween. The first channel area is an area disposedunder the second pipe gate PG2, and the second channel area is an areadisposed above the second pipe gate PG2.

Bottom surfaces of the first and second source side channels S_CH1 andS_CH2 and the first and second drain side channels D_CH1 and D_CH2 maybe disposed on the same plane. Accordingly, it may be possible tosimplify a process of forming holes in which the first and second sourceside channels S_CH1 and S_CH2 and the first and second drain sidechannels D_CH1 and D_CH2 are disposed.

The first pipe channel P_CH1 may have a U-shaped longitudinal sectionstructure including a first part parallel to the second pipe channelP_CH2 and protrusions protruding from the first part to the bottomsurface of the first source side channel S_CH1 and the first drain sidechannel D_CH1. An entire surface of the upper surface of the second pipechannel P_CH2 may be disposed on the same plane as the bottom surface ofthe second source side channel S_CH2 and the second drain side channelD_CH2, and may be formed to be flat.

Each of the first channel layer CH1 and the second channel layer CH2 isdisposed inside the through-hole defined according to a shape thereof.The first channel layer CH1 and the second channel layer CH2 may beformed of a tube-type semiconductor layer surrounding an insulatingmaterial filled in a center area of the through-hole. In an embodiment,each of the first channel layer CH1 and the second channel layer CH2 maybe formed of a buried semiconductor layer filled from a surface of thethrough hole to a center area of the through-hole. In an embodiment,each of the first channel layer CH1 and the second channel layer CH2 maybe formed in a structure in which a buried type and a tube type arecombined. Although not illustrated in the drawing, an external wall ofeach of the first channel layer CH1 and the second channel layer CH2 maybe surrounded by a multilayer of three or more layers including a tunnelinsulating layer, a data storing layer, and a blocking insulating layer.

The source side stack structure S_ML and the drain side stack structureD_ML may be separated by a slit. The separation structure of the sourceside stack structure S_ML and the drain side stack structure D_ML may bevariously changed according to a form of the slit.

The source side stack structure S_ML is passed through by the firstsource side channel S_CH1 and the second source side channel S_CH2. Thesource side stack structure S_ML may include source side word linesS_WL. The source side word lines S_WL are stacked while being spacedapart from each other. The source side stack structure S_ML may includea source select line SSL of one or more layers stacked on the sourceside word lines S_WL. The source select line SSL may be formed with thesame thickness as that of the source side word lines SL_WL, or with alarger thickness than that of the source side word lines SL_WL. Thesource select line SSL is spaced apart from the source side word linesS_WL. The source side word lines S_WL and the source select line SSL maybe extended in the first direction (for example, the Y-direction) whilesurrounding the first source side channel S_CH1 and the second sourceside channel S_CH2.

The drain side stack structure D_ML is passed through by the first drainside channel D_CH1 and the second drain side channel D_CH2. The drainside stack structure D_ML includes drain side word lines D_WL. The drainside word lines D_WL are stacked while being spaced apart from eachother. The drain side stack structure D_ML includes drain select linesDSL1 and DSL2 of one or more layers stacked on the drain side word linesD_WL. The drain select lines DSL1 and DSL2 are spaced apart from thedrain side word lines D_WL. The drain select lines DSL1 and DSL2 may bedivided into a first drain select line DSL1 surrounding the first drainside channel D_CH1, and a second drain select line DSL2 surrounding thesecond drain side channel D_CH2. The drain side word lines D_WL and thedrain select lines DSL1 and DSL2 may be extended in the first direction(for example, the Y-direction) while surrounding the first drain sidechannel D_CH1 and the second drain side channel D_CH2.

The source side stack structure S_ML and the drain side stack structureD_ML may be formed with the same height or substantially the sameheight. A source line SL and bit lines BL are disposed on the sourceside stack structure S_ML and the drain side stack structure D_ML. Thesource line SL and the bit lines BL are disposed while being spacedapart from each other. For example, the bit lines BL may be spaced apartfrom the source line SL to be disposed on the source line SL.

The source line SL is commonly connected to the first source sidechannel S_CH1 and the second source side channel S_CH2. The source lineSL may be extended in the first direction (Y-direction).

The bit lines BL may be extended in a second direction (for example, anX-direction) crossing the first direction (Y-direction). The bit linesBL are connected to the first and second drain side channels D_CH1 andD_CH2 arranged in the extended directions thereof, respectively.

According to the aforementioned structure, a pipe transistor is formedat a crossing part of the pipe gate PG and the first channel layer CH1or a crossing part of the pipe gate PG and the second channel layer CH2.Memory cells are formed at crossing parts of the word lines D_WL andS_WL and the first channel layer CH1 or crossing parts of the word linesD_WL and S_WL and the second channel layer CH2. A source selecttransistor is formed at a crossing part of the source select line SSLand the first channel layer CH1 or a crossing part of the source selectline SSL and the second channel layer CH2. A drain select transistor isformed at a crossing part of the first drain select lines DSL1 and thefirst channel layer CH1 or a crossing part of the second drain selectlines DSL2 and the second channel layer CH1. Accordingly, a first memorystring including the drain select transistor, the memory cells, the pipetransistor, and the source select transistor serially connected by thefirst channel layer CH1 is connected between one bit line BL and thesource line SL. Further, a second memory string including the drainselect transistor, the memory cells, the pipe transistor, and the sourceselect transistor serially connected by the second channel layer CH2 isconnected between one bit line BL and the source line SL. An area inwhich the second memory string is formed may be defined within an areaoccupied by the first memory string, thereby improving integration ofthe memory device within a limited space in an example of an embodiment.

Referring to FIG. 1B, the second pipe channel P_CH2 overlaps the firstpipe channel P_CH1. The second drain side channel D_CH2 and the secondsource side channel S_CH2 may be connected to both ends of the secondpipe channel P_CH2.

The second pipe channel P_CH2 is formed to be shorter than the firstpipe channel P_CH1 so that both ends of the first pipe channel P_CH1 isexposed by the second pipe channel P_CH2. Accordingly, the first drainside channel D_CH1 and the first source side channel S_CH1 may beconnected to both ends of the first pipe channel P_CH1.

Pipe channel groups GR each including the first and second pipe channelsP_CH1 and P_CH2 overlapping each other may be arranged in a matrix formin the first direction (Y-direction) and the second direction (forexample, the X-direction) orthogonal to the first direction(Y-direction). Further, the pipe channel groups GR may be arranged in azigzag form in order to improve integration of the memory device. Forexample, the pipe channel groups GR may be arranged to be parallel inthe first direction (Y-direction), and may be arranged so that centersthereof are dislocated in the second direction (X-direction).

The source select line SSL may be formed while simultaneouslysurrounding the first source side channels S_CH1 in two columns and thesecond source side channels S_CH2 in the two columns, which are adjacentto each other. In an embodiment, the source select line SSL may bedivided into first to fourth line parts surrounding the first sourceside channels S_CH1 in two columns and the second source side channelsS_CH2 in the two columns, which are adjacent to each other, in a unit ofone column, respectively. In an embodiment, the source select line SSLmay be divided into first and second line parts surrounding the firstsource side channels S_CH1 in two columns and the second source sidechannels S_CH2 in the two columns, which are adjacent to each other, ina unit of two columns, respectively.

The source side word lines S_WL may be formed while simultaneouslysurrounding the first source side channels S_CH1 in two columns and thesecond source side channels S_CH2 in the two columns which are adjacentto each other. In an embodiment, the source side word lines S_WL may bedivided into first to fourth line parts surrounding the first sourceside channels S_CH1 in two columns and the second source side channelsS_CH2 in the two columns in a unit of one column, which are adjacent toeach other, respectively. In an embodiment, the source side word linesS_WL may be divided into first and second line parts surrounding thefirst source side channels S_CH1 in two columns and the second sourceside channels S_CH2 in the two columns, which are adjacent to eachother, in a unit of one column, respectively.

The drain select lines DSL1 and DSL2 may be divided into a first drainselect line DSL1 surrounding the first drain side channel D_CH1 in onecolumn, and a second drain select line DSL2 surrounding the second drainside channel D_CH2 in the one column. In an embodiment, the first drainside channel D_CH1 in the one column and the second drain side channelD_CH2 in the one column, which are adjacent to each other, may besimultaneously surrounded by one drain select line.

The drain side word lines D_WL may be formed while simultaneouslysurrounding the first source side channel S_CH1 in one column and thesecond source side channel S_CH2 in the one column, which are adjacentto each other. In an embodiment, the drain side word lines D_WL may bedivided into a first line parts surrounding the first drain side channelD_CH1 in one column and a second line part surrounding the second drainside channel D_CH2 in the one column, which are adjacent to each other.

Referring to FIGS. 1C and 1D, the second pipe channel P_CH2 overlaps thefirst pipe channel P_CH1 with the second pipe gate PG2 interposedtherebetween. Areas, in which the first pipe channel P_CH1 and thesecond pipe channel P_CH2 are formed, may be divided by the partitionpipe gate PT passing through the second pipe gate PG to be in contactwith a surface of the first pipe gate PG1. The first pipe channel P_CH1is formed to be higher in an area non-overlapping the second pipechannel P_CH2 than an area overlapping the second pipe channel P_CH2.

The third pipe gate PG3 is formed to cover the partition pipe gate PT,the first and second pipe gates PG1 and PG2, and the first and secondpipe channels P_CH1 and P_CH2, and is passed through by the first andsecond drain side channels D_CH1 and D_CH2 (see FIG. 1A) and the firstand second source side channels S_CH1 and S_CH2.

The source side stack structure S_ML and the drain side stack structureD_ML (see FIG. 1A) may include interlayer insulating patterns ILD andthe conductive patterns S_WL, SSL, D_WL, DSL1 or DSL2 (see FIG. 1A)which are alternately stacked. The conductive patterns of the sourceside stack structure S_ML may include the source side word lines S_WLand the source select line SSL. The conductive patterns of the drainside stack structure D_ML may include the drain side word lines D_WL(see FIG. 1A) and the drain select lines DSL1 and DSL2.

FIGS. 2A to 2D are diagrams illustrating a representation of an exampleof a structure of the pipe gate according to an embodiment. Moreparticularly, FIG. 2A is a top plan view illustrating a representationof an example of the pipe gate structure formed under the source sidestack structure and the drain side stack structure. FIG. 2B is aperspective view of the pipe gate embedded with the first and secondpipe channels. FIG. 2C is a perspective view of the first and secondpipe gates. FIG. 2D is a perspective view of the partition pipe gate.

Referring to FIGS. 2A to 2D, the first pipe gate PG1 may include atrench T extended in the first direction (for example, the Y-direction).The trench T may be extended in the second direction (for example, theX-direction) crossing the first direction (Y-direction). The first pipegate PG1 including the trench T may have a U-shaped longitudinal sectionstructure.

The second pipe gate PG2 is spaced apart from a surface of the trench Tto be formed according to a shape of the surface of the trench T.Accordingly, the second pipe gate PG2 may have a U-shaped longitudinalsection structure. The trench T may be divided into a first space S1adjacent to the surface of the trench T and a second space S2 above thesecond pipe gate PG2 by the second pipe gate PG2. The first space S1 maybe formed according to the shape of the surface of the trench T, and mayhave a U-shaped longitudinal section structure. The first space S1 andthe second pipe gate PG2 having the U-shaped longitudinal sectionstructure are extended in the first direction (Y-direction) that is theextension direction of the trench T.

The partition pipe gate PT is extended in the direction crossing thefirst direction (Y-direction). For example, the partition pipe gate PTmay be extended in the second direction (for example, the X-direction)vertically crossing the first direction (Y-direction). The partitionpipe gate PT divides the first space S1 into the first channel areas inwhich the first pipe channels P_CH1 are disposed, and divides the secondspace S2 into the second channel areas in which the second pipe channelsP_CH2 are disposed. To this end, the partition pipe gate PT may includea first pattern P1, second and third patterns P2 and P3 facing with thefirst pattern P1 of the partition pipe gate PT interposed therebetween,and a fourth pattern P4 and a fifth pattern P5 connecting the first tothird patterns P1 to P3.

The first pattern P1 is a part extended in an extended direction of thepartition pipe gate PT to be in contact with the second pipe gate PG2.The first pattern P1 is extended to pass through a bottom surface of thesecond pipe gate PG2 from an internal side of the second space S2. Thesecond pipe gate PG2 has partition holes H_PT into which the firstpattern P1 is insertable. The partition holes H_PT may be arranged inseries in the extended direction of the second pipe gate PG2.

The second pattern P2 and the third pattern P3 are parts disposed in anextended line of the first pattern P1, and connected between a lateralwall of the second pipe gate PG2 and a lateral wall of the first pipegate PG1 within the first space S1 at both sides of the first patternP1.

The fourth pattern P4 is a part extended from bottom surfaces of thefirst to third patterns P1 to P3 to the surface of the trench T.

The fifth pattern part P3 is a part extended from upper surfaces of thefirst to third patterns P1 to P3 to a height of an upper surface of thefirst pipe gate PG1. The fifth pattern P5 is connected between thelateral walls of the trench T which face each other. The fifth patternP5 may be formed while passing through both ends of the second pipe gatePG2 at a predetermined thickness. The second pipe gate PG2 may haveconcave parts C_PT into which the fifth pattern P5 is insertable. Theconcave parts C_PT may be formed at both ends of the second pipe gatePG2, and arranged in the extended direction of the second pipe gate PG2.

The first space S1 may be divided into the first channel areas, in whichthe first pipe channels P_CH1 are disposed, by the second to fifthpatterns P2 to P5. The second space S2 may be divided into the secondchannel areas, in which the second pipe channels P_CH2 are disposed, bythe first and the fifth patterns P1 and P5.

The first drain side channel D_CH1 and the second pattern P2 may bealternately disposed in the extended direction of the trench T. Thefirst source side channel S_CH1 and the third pattern P3 may bealternately disposed in the extended direction of the trench T. The pairof second drain side channel D_CH2 and second source side channel S_CH2,and the first pattern P1 may be alternately disposed in the extendeddirection of the trench T.

The partition pipe gates PT may be arranged in a zigzag form in thedirection (X-direction) vertically crossing the extended direction ofthe trench T. More particularly, the partition pipe gates PT may bearranged so that the centers thereof are dislocated in the direction(X-direction) vertically crossing the extended direction of the trenchT.

The partition pipe gate PT is in contact with the first and second pipegates PG1 and PG2 to be electrically connected to with the first andsecond pipe gates PG1 and PG2. The second pipe gate PG2 may beelectrically connected to the first pipe gate PG1 through the partitionpipe gate PT. The third pipe gate PG3 illustrated in FIG. 1A is incontact with upper surfaces of the first and second pipe gates PG1 andPG2 and the partition pipe gate PT to be electrically connected to thefirst and second pipe gates PG1 and PG2 and the partition pipe gate PT.

Hereinafter, a method of manufacturing a semiconductor device accordingto an example of an embodiment will be described with reference to FIGS.3A to 7F.

FIGS. 3A and 3B are a top plan view and a cross-sectional view fordescribing a representation of an example of a process of forming atrench of a 3D memory device according to an example of an embodiment,respectively.

Referring to FIGS. 3A and 3B, a first conductive layer is formed on asubstrate, and then a first mask pattern 101 is formed on the firstconductive layer. Then, an opening area of the first conductive layer isetched with a predetermined thickness by an etch process using the firstmask pattern 101 as an etch barrier. Accordingly, a first pipe gate PG1including trenches T may be formed.

The first conductive layer may include, for example, a poly siliconlayer. The first mask pattern 101 may be removed after the trenches Tare formed. The trench T may be extended in a first direction (forexample, an Y-direction). The trenches T may be arranged in parallel ina direction (for example, an X-direction) crossing the extendeddirection (Y-direction) of the trench T.

FIGS. 4A and 4B are a top plan view and a cross-sectional view fordescribing a representation of an example of a process of forming atrench filled structure.

Referring to FIGS. 4A and 4B, a first sacrificial layer 111 and a secondconductive layer are sequentially stacked along surfaces of the trenchesT. The first sacrificial layer 111 is formed of a different materialfrom that of the first and second conductive layers. For example, thefirst sacrificial layer 111 may include TiN. The second conductive layermay include, for example, poly silicon as a conductive material used asa second pipe gate PG2. The second conductive layer may open a centerarea of the trench T, and may be formed according to a shape of thesurface of the trench T.

Next, the center areas of the trenches T opened by the second conductivelayer are filled with a second sacrificial layer 113. The secondsacrificial layer 113 may be formed of a different material from that ofthe first and second conductive layers. The second sacrificial layer 113may be formed of the same material as that of the first sacrificiallayer 111. For example, the second sacrificial layer 113 may includeTiN.

Then, surfaces of the second sacrificial layer 113, the secondconductive layer, and the first sacrificial layer 111 are planarized toallow an upper surface of the first pipe gate PG1 to be exposed.Accordingly, a trench filled structure TFS including the secondsacrificial layer, the second pipe gate PG2 formed of the secondconductive layer, and the first sacrificial layer 111 is formed in aunit of the trench T. The trench filled structure TFS may be formedwhile an internal side of the trench T is completely filled. In theabove description, the planarization may be performed by, for examplebut not limited to, a Chemical Mechanical Polishing (CMP) method.

According to the aforementioned process, in an example of an embodiment,the first sacrificial layer 111 and the second pipe gate PG2 are formedaccording to the shape of the surface of the trench T without separatelyperforming a mask process. In an example of an embodiment, even though aseparate mask process is not performed, the trench T may be divided intoa first space S1 under the second pipe gate PG2 and a second space S2above the second pipe gate PG2.

FIGS. 5A to 5D are a top plan view and cross-sectional views fordescribing a representation of an example of a process of dividing thefirst and second sacrificial layers into first and second sacrificialpatterns. Particularly, FIG. 5A is a top plan view illustrating anexample of a layout of a second mask pattern, and FIGS. 5B to 5D arecross-sectional views for each process step taken along line A-A′illustrated in FIG. 5A.

Referring to FIG. 5A, a second mask pattern 121 including openings OPfor opening areas, in which partition pipe gates PT (see FIG. 5B) are tobe formed, are formed on the first pipe gate PG1 including the trenchfilled structure TFS illustrated in FIG. 4A. The openings OP may bearranged in series in the extended direction (Y-direction) of the trenchT (see FIG. 4A). The opening OP may vertically cross the extendeddirection (Y-direction) of the trench T (see FIG. 4A). The opening OPmay be extended so that lateral walls of the trench, which face eachother, are exposed. Accordingly, the lateral walls of the trench, whichface each other, may be exposed by both ends of the opening OP. Theopenings OP may be arranged in a zigzag form in the direction(X-direction) vertically crossing the extended direction (Y-direction)of the trench T (see FIG. 4A). More particularly, the openings OP may bearranged so that the centers thereof are dislocated in the direction(X-direction) vertically crossing the extended direction of the trenchT.

Referring to FIG. 5B, the first sacrificial layer 111 and the secondsacrificial layer 113 are etched by using the second mask pattern 121 asan etch barrier until a bottom surface of the second pipe gate PG2 isexposed.

Referring to FIG. 5C, the second pipe gate PG2 is etched by using thesecond mask pattern 121 as the etch barrier so that partition holes H_PTpassing through the bottom surface of the second pipe gate PG2 areformed. In this example, parts of both ends of the second pipe gate PG2,which are exposed by the opening OP, are etched, so that concave partsC_PT may be formed in the second pipe gate PG2. The concave parts C_PTare disposed in an extended line of the partition hole H_PT. The concaveparts C_PT and the partition hole H_PT are located at different heightsin the trench T. The first sacrificial layer 111 under the second pipegate PG2 is exposed by the partition hole H_PT.

Referring to FIG. 5D, the sacrificial layer 111 (see FIG. 5C) is etchedby using the second mask pattern 121 as the etch barrier until thebottom surface TB of the trench T is exposed.

By the processes described with reference to FIGS. 5A to 5D, the firstsacrificial layer 111 may be divided into first sacrificial patterns,and the second sacrificial layer 113 may be divided into secondsacrificial patterns. A boundary between the first sacrificial patternsand a boundary between the second sacrificial patterns correspond to theopenings OP of the second mask pattern 121. After the first sacrificialpatterns and the second sacrificial patterns are formed, the second maskpattern 121 may be removed.

FIGS. 6A and 6B are a top plan view and a cross-sectional view fordescribing a representation of an example of a process of forming thepartition pipe gate. Particularly, FIG. 6A is a top plan viewillustrating an example of a layout of first to third patterns of thepartition pipe gate, and FIG. 6B is a cross-sectional view taken alongline A-A′ illustrated in FIG. 6A.

Referring to FIGS. 6A and 6B, the areas, in which the first sacrificiallayer, the second pipe gate, and the second sacrificial layer areremoved by the processes aforementioned with reference to FIGS. 5A to5D, are filled with the partition pipe gate PT. The partition pipe gatePT may include first to fifth patterns P1 to P5. The first pattern P1 isdisposed between both ends of the second pipe gate PG2 and is filled inthe partition hole H_PT. The second and third patterns P2 and P3 facewith the first pattern P1 and both ends of the second pipe gate PG2interposed therebetween, and are extended from a lateral wall of thesecond pipe gate PG2 to a lateral wall of the first pipe gate PG1. Afifth pattern P5 is extended from upper surfaces of the first to thirdpatterns P1 to P3 to a height of an upper surface of the first pipe gatePG1 while being filled in the concave part C_PT (see FIG. 5D) of thesecond pipe gate PG2. A fourth pattern part P4 is extended from bottomsurfaces of the first to third patterns P1 to P3 to the bottom surfaceTB of the trench T.

The aforementioned partition pipe gates PT are formed at the boundarybetween the first sacrificial patterns 111P and the boundary between thesecond sacrificial patterns 113P to separate the first sacrificialpatterns 111P and the second sacrificial patterns 113P.

FIGS. 7A to 7F are cross-sectional views for describing a representationof an example of subsequent processes after the partition pipe gate PTis formed. More particularly, FIGS. 7A to 7F are cross-sectional viewsfor each process step taken along line B-B′ illustrated in FIG. 6A.

Referring to FIG. 7A, a third pipe gate PG3 covering the partition pipegate PT, the first sacrificial patterns 111P, the second sacrificialpatterns 113P, the second pipe gate PG2, and the first pipe gate PG1 maybe formed. The third pipe gate PG3 may be formed of, for example, polysilicon.

Next, first material layers 131 and second material layers 133 arealternately stacked. The second material layers 133 are formed of adifferent material from that of the first material layers 131.

For example, the first material layers 131 may be formed of insulatinglayers for interlayer insulating patterns, and the second materiallayers 133 may be formed of conductive layers for the word lines and theselect lines.

In an embodiment, the first material layers 131 may be formed ofinsulating layers for interlayer insulating patterns, and the secondmaterial layers 133 may be formed of sacrificial insulating layershaving etch selectivity for the first material layers 131. In thisexample, the first material layers 131 may be formed of silicon oxidelayers, and the second material layers 133 may be formed of siliconnitride layers.

In an embodiment, the first material layers 131 may be formed ofsacrificial conductive layers having etch selectivity for the secondmaterial layers 133, and the second material layers 133 may be formed ofconductive layers for the word lines and the select lines. In thisexample, the first material layers 131 may be formed of un-doped polysilicon layers, and the second material layers 133 may be formed ofdoped poly silicon layers.

Referring to FIG. 7B, a plurality of pairs of first and second holesH1_D and H1_S exposing both ends of the first sacrificial patterns 111Pand a plurality of pairs of third and fourth holes H2_D and H2_Sexposing both ends of the second sacrificial patterns 113P are formed byetching the first material layers 131 and the second material layers133. The third and fourth holes H2_D and H2_S are disposed between thefirst and second holes H1_D and H1_S. When the third pipe gate PG3 isformed, the third pipe gate PG3 is etched so that the first to fourthholes H1_D, H1_S, H2_D, and H2_S may further pass through the third pipegate PG3.

According to an example of an embodiment, both ends of the firstsacrificial patterns 111P and both ends of the second sacrificialpatterns 113P are positioned within the same plane by the planarizationprocess described with reference to FIGS. 4A and 4B. Accordingly, totalheights of the materials disposed on both ends of the first sacrificialpatterns 111P and both ends of the second sacrificial patterns 113P aresimilar to each other, thereby improving stability of the etch processfor forming the first to fourth holes H1_D, H1_S, H2_D, and H2_S.

Referring to FIG. 7C, the first sacrificial patterns 111P and the secondsacrificial patterns 113P exposed by the first to fourth holes H1_D,H1_S, H2_D, and H2_S are removed. Then, internal sides of the first tofourth holes H1_D, H1_S, H2_D, and H2_S, and internal sides of theareas, in which the first sacrificial patterns 111P and the secondsacrificial patterns 113P are removed are filled with a semiconductorlayer. Next, a surface of the semiconductor layer is planarized so thatthe semiconductor layer is divided in the unit of the first to fourthholes H1_D, H1_S, H2_D, and H2_S. Accordingly, a first channel layer anda second channel layer are formed.

The first channel layer includes a first pipe channel P_CH1 disposedinside each of the first channel areas, in which the first sacrificialpatterns 111P are removed, first drain side channels D_CH1 disposedinside the first holes H1_D, and first source side channels S_CH1disposed inside the second holes H1_S. The first pipe channel P_CH1 mayhave a U-shaped longitudinal cross-section structure, and the firstdrain side channel D_CH1 and the first source side channel S_CH1 may beconnected to both ends of the U-shaped first pipe channel P_CH1.

The second channel layer may include a second pipe channel P_CH2disposed inside each of the second channel areas, in which the secondsacrificial patterns 113P are removed, second drain side channels D_CH2disposed inside the third holes H2_D, and second first source sidechannels S_CH2 disposed inside the fourth holes H2_S. The second pipechannel P_CH2 may be disposed on the first pipe channel P_CH1, and thesecond drain side channel D_CH2 and the second source side channel S_CH2may be connected to both ends of the second pipe channel P_CH2.

In the above, the semiconductor layer may be formed in a tube type, ofwhich a center area is opened. In this example, the center area of thetube-type semiconductor layer may be filled with an insulating layer(not illustrated). In an embodiment, the semiconductor layer may beformed in a buried type which is completely filled in the internal sidesof the first to fourth holes H1_D, H1_S, H2_D, and H2_S, and the areas,in which the first sacrificial patterns 111P and the second sacrificialpatterns 113P are removed.

Before the semiconductor layer is formed, three or more layers includinga blocking insulating layer, a data storing layer, and a tunnelinsulating layer may be further formed along the internal sides of thefirst to fourth holes H1_D, H1_S, H2_D, and H2_S, and surfaces of theareas, in which the first sacrificial patterns 111P and the secondsacrificial patterns 113P are removed.

Then, first slits 151 passing through the first and second materiallayers 131 and 133 are formed by etching the first and second materiallayers 131 and 133. The first slit 151 may pass through a space betweenthe second drain side channel D_CH2 and the second source side channelS_CH2 which are adjacent to each other, and be formed in a unit of amemory block or a memory string.

A subsequent process may be variously changed according to the type ofmaterial of the first and second material layers 131 and 133.

For example, when the first material layers 131 are formed of theinsulating layers for the interlayer insulating patterns, and the secondmaterial layers 133 are formed of the conductive layers for the wordlines and the select lines, the first material layers 131 and the secondmaterial layers 133 may be divided into the source side stack structureand the drain side stack structure described with reference to FIG. 1A.

In an embodiment, when the first material layers 131 are formed of theinsulating layers for the interlayer insulating patterns, and the secondmaterial layers 133 are formed of the sacrificial insulating layers, theprocess illustrated in FIGS. 7D and 7E are performed.

Referring to FIG. 7D, conductive pattern areas CPA between the firstmaterial layers 131 are opened by removing the second material layers133 exposed by the first slit 151.

Referring to FIG. 7E, conductive patterns CP are formed inside theconductive pattern areas CPA, respectively. Each of the conductivepatterns CPs may include at least one of a poly silicon layer, a metalsilicide layer, and a metal layer. When each of the conductive patternsCP is formed of a metal layer, such as tungsten, having lower resistancethan that of poly silicon, a barrier metal, such as TiN, may be furtherformed along a surface of each of the conductive patterns CP. When thethree or more layers including the tunnel insulating layer, the datastoring layer, and the blocking insulating layer are not formed beforethe semiconductor layer described in FIG. 7C is formed, the three ormore layers including the tunnel insulating layer, the data storinglayer, and the blocking insulating layer may be formed along a surfaceof each of the conductive pattern areas CPA before the conductivepatterns CP are formed.

The conductive patterns CP may be used as word lines, a source selectline, or a drain select line. For example, patterns of one or morelayers from a top most layer among the conductive patterns CP may beused as a source select line or a drain select line, and the patternsthereunder may be used as word lines. The conductive patterns CP may bedivided into the source side stack structure and the drain side stackstructure described with reference to FIG. 1A by the first slits 151.

Although not illustrated in the drawing, when the first material layers131 are formed of sacrificial conductive layers, and the second materiallayers 133 are formed of conductive layers, the first material layers131 may be divided into the source side stack structure and the drainside stack structure by the first slits 151. The second material layers133 exposed by the first slits 151 may be removed, so that insulatingpattern areas between the first material layers 131 may be opened. Theinsulating pattern areas may be filled with the interlayer insulatingpatterns. The interlayer insulating patterns may be divided into thesource side stack structure and the drain side stack structure by thefirst slits 151.

As described above, after the source side stack structure and the drainside stack structure divided by the first slits 151 and including theconductive patterns CP and the interlayer insulating patterns areformed, a process illustrated in FIG. 7F may be performed.

Referring to FIG. 7F, the first slit 151 is filled with a first slitinsulating layer 161. Next, a second slit insulating layer 171 passingthrough the conductive patterns disposed on at least one layer from thetop most layer among the conductive patterns CP may be further formed.

For example, a drain side conductive pattern CP_D on the topmost layeramong the conductive patterns simultaneously surrounding the first andsecond drain side channels D_CH1 and D_CH2 may be divided into a firstdrain select line DSL1 surrounding the first drain side channels D_CH1and a second drain select line DSL2 surrounding the second drain sidechannels D_CH2. The second slit insulating layer 171 may be formed byforming the second slit until the target conductive pattern passesthrough, and then filling inside the second slit with an insulatingmaterial.

In the above, a disposition form and a location of the second slitinsulating layer 171 may be variously changed.

According to the aforementioned example of an embodiment, even though analignment degree is not controlled by using a photolithography device,the second pipe channel P_CH2 may be automatically aligned on the firstpipe channel P_CH1. Accordingly, in an example of an embodiment, it maybe possible to form an overlapping structure of the dual pipe channelsby a simplified process.

FIG. 8 is a diagram for describing a representation of an example of astructure of the pipe gate according to an embodiment. Referring to FIG.8, the pipe gate according to an embodiment may include the first pipegate PG1 extended in the first direction (Y-direction) identically tothat described with reference to FIGS. 2A to 2D. The trench T of thefirst pipe gate PG1 may be divided into a first space and a second spaceby the second pipe gate PG2 as described with reference to FIGS. 2A to2C. The second pipe gate PG2 includes a partition hole and a concavepart as described with reference to FIG. 2D.

An arrangement direction of the partition hole and the concave part maybe changed by the extended direction of the partition pipe gate PT. Thepartition pipe gate PT illustrated in FIG. 8 is extended in a directiondifferent from the extended direction of the partition pipe gatedescribed with reference to FIGS. 2A to 2D. For example, the partitionpipe gate PT illustrated in FIG. 8 may be extended in a directionobliquely crossing the extended direction (Y-direction) of the trench T.The partition pipe gate PT divides the first space under the second pipegate PG2 into first channel areas in which the first pipe channels P_CH1are disposed, and the second space S2 above the second pipe gate PG2into second channel areas in which the second pipe channels P_CH2 aredisposed as described with reference to FIGS. 2A to 2D. The partitionpipe gate PT may include the first to fifth patterns as described withreference to FIG. 2D.

Each of the first pipe channel P_CH1 and the second pipe channel P_CH2may be extended in the extended direction of the partition pipe gate PT.For example, each of the first pipe channel P_CH1 and the second pipechannel P_CH2 may be obliquely extended in the extended direction(Y-direction) of the trench T.

The first drain side channel D_CH1 and the first source side channelS_CH1 connected to the first pipe channel P_CH1 may be disposed in theextended direction of the partition pipe gate PT. For example, the firstdrain side channel D_CH1 and the first source side channel S_CH1 may beobliquely disposed in the extended direction (Y-direction) of the trenchT.

The second drain side channel D_CH2 and the second source side channelS_CH2 connected to the second pipe channel P_CH2 may be disposed in theextended direction of the partition pipe gate PT. For example, thesecond drain side channel D_CH2 and the second source side channel S_CH2may be obliquely disposed in the extended direction (Y-direction) of thetrench T.

According to the various embodiments, the line-type trench extended in apredetermined direction may be formed inside the first pipe gate, andthe internal side of the trench may be divided into the first and secondchannel areas by using the second pipe gate and the partition pipe gate,thereby improving integration of the memory device.

According to the various embodiments, the first and second channel areasmay be divided by a simplified process using a shape of the surface ofthe trench formed inside the first pipe gate.

FIG. 9 is a configuration diagram illustrating a representation of anexample of a memory system according to an embodiment.

Referring to FIG. 9, a memory system 1100 according to an example of anembodiment may include a memory device 1120 and a memory controller1110.

The memory device 1120 may include the structures of the variousembodiments described above with reference to FIGS. 1A to 8. Further,the memory device 1120 may be a multi-chip package formed of a pluralityof flash memory chips.

The memory controller 1110 may be configured to control the memorydevice 1120, and may include an SRAM 1111, a CPU 1112, a host interface1113, an ECC 1114, and a memory interface 1115. The SRAM 1111 is used asan operation memory of the CPU 1112, the CPU 1112 performs a generalcontrol operation for data exchange of the memory controller 1110, andthe host interface 1113 includes a data exchange protocol of the hostconnected to the memory system 1100. The ECC 1114 detects and correctsan error included in data read from the memory device 1120, and thememory interface 1115 performs interfacing with the memory device 1120.The memory controller 1110 may further include an ROM and the like forstoring code data for the interfacing with the host.

As described above, the memory system 1100 including the aforementionedconfiguration may be a memory card or a Solid State Disk (SSD) in whichthe memory device 1120 is combined with the memory controller 1110. Forexample, when the memory system 1100 is the SSD, the memory controller1110 may communicate with an external device (for example, a host)through one of various interface protocols, such as, for example but notlimited to, USB, MMC, PCI-E, SATA, PATA, SCSI, ESDI, and IDE.

FIG. 10 is a configuration diagram illustrating a representation of anexample of a computing system according to an embodiment.

Referring to FIG. 10, a computing system 1200 according to an embodimentmay include a CPU 1220, a RAM 1230, a user interface 1240, a modem 1250,and a memory system 1210, which are electrically connected to a systembus 1260. Further, in an example where the computing system 1200 is amobile device, the computing system 1200 may further include a batteryfor supplying an operational voltage to the computing system 1200, andmay further include an application chip-set, a camera image sensor CIS,a mobile DRAM, and the like.

The memory system 1210 may be formed of a memory device 1212 and amemory controller 1211 as previously described with reference to FIG. 9.

As described above, the embodiments have been disclosed with referenceto the drawings and the specification. The specific terms used hereinare for purposes of illustration, and do not limit the scope of theapplication. Accordingly, those skilled in the art will appreciate thatvarious modifications and another equivalent example may be made withoutdeparting from the scope and spirit of the present disclosure.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising: forming a trench extended in a first direction within afirst pipe gate; forming a trench filled structure including a firstsacrificial layer along a surface of the trench, a second pipe gatealong a surface of the first sacrificial layer, and a second sacrificiallayer filled in a center area of the trench opened by the second pipegate inside the trench, wherein both ends of the first sacrificiallayer, both ends of the second sacrificial layer and a top surface ofthe second pipe gate are disposed on a same plane as a top surface ofthe first pipe gate; and forming a partition pipe gate disposed withinthe trench in a second direction crossing the first direction to dividethe first sacrificial layer into first sacrificial patterns and todivide the second sacrificial layer into second sacrificial patterns. 2.The method of claim 1, wherein the forming of the trench filledstructure includes: sequentially forming the first sacrificial layer andthe second pipe gate along the surface of the trench; forming the secondsacrificial layer on the second pipe gate to fill a center area of thetrench opened by the second pipe gate; and planarizing the secondsacrificial layer, the second pipe gate, and the first sacrificial layerto expose the first pipe gate.
 3. The method of claim 1, wherein theforming of the partition pipe gate includes: forming a mask patternincluding an opening corresponding to the partition pipe gate on thefirst pipe gate including the trench filled structure; etching the firstsacrificial layer and the second sacrificial layer by using the maskpattern as an etch barrier until a bottom surface of the second pipegate is exposed; forming a partition hole passing through the bottomsurface of the second pipe gate by etching the second pipe gate by usingthe mask pattern as the etch barrier; etching the first sacrificiallayer exposed through the partition hole by using the mask pattern asthe etch barrier until a bottom surface of the trench is exposed;removing the mask pattern; and filling areas with the partition pipegate where the first sacrificial layer, the second pipe gate, and thesecond sacrificial layer were removed.
 4. The method of claim 3, whereinin the forming of the partition hole, both ends of the second pipe gateare etched to form concave parts at both ends of the second pipe gate.5. The method of claim 1, further comprising: alternately stacking firstmaterial layers and second material layers on the first pipe gateincluding the trench filled structure after the forming of the partitionpipe gate; forming first and second holes for exposing both ends of eachof the first sacrificial patterns, and third and fourth holes forexposing both ends of each of the second sacrificial patterns whilepassing through the first material layers and the second materiallayers; removing the first and second sacrificial patterns exposedthrough the first to fourth holes; filling areas with a channel layerwhere the first and second sacrificial patterns were removed; fillingthe first to fourth holes with the channel layer; and forming slits fordividing the first material layers and the second material layers into asource side stack structure and a drain side stack structure whilepassing through the first material layers and the second material layersbetween the third and fourth holes.
 6. The method of claim 5, furthercomprising: covering the first pipe gate including the trench filledstructure with a third pipe gate before the alternately stacking of thefirst material layers and the second material layers, wherein the thirdpipe gate is passed through the first to fourth holes.
 7. The method ofclaim 1, wherein the first sacrificial layer has a U-shaped longitudinalcross-section structure; and wherein the second pipe gate has a U-shapedlongitudinal cross-section structure.
 8. The method of claim 7, whereinthe first sacrificial layer having the U-shaped longitudinalcross-section structure is extended in the first direction; and whereinthe second pipe gate having the U-shaped longitudinal cross-sectionstructure is extended in the first direction.
 9. The method of claim 1,wherein each of the first sacrificial patterns has a U-shapedlongitudinal cross-section structure.